Job Description
Join the MediaTek Chip Physical Verification team and help create technology for products that will delight and inspire millions of people every day. As a member of our team, you will define and enable physical sign-off flows and solutions for SoC and Multi-Dies (3D IC) design, ensuring first-time success in product tape-out. In this role, you will develop and implement technologies at advanced process nodes, contributing to the success of cutting-edge products.
Job Responsibilities
- Responsible for Multi-Dies Physical Verification Sign-off in area of (3D_Stack, 3D_PERC, 3D_ANT) for tape-out.
- Co-work with Package Design Team to resolve multi-dies integration issues.
- Co-work with ESD Team to run 3D_PERC flow.
- Coordinates with Chip PV Team on active dies related issues (DRC, LVS, ANT, ERC, ESD)
- Provide automation solutions to improve efficiency in tape-out flow.
- Report on Tapeout PV issues.
Requirement
- Bachelor/Master's Degree in Electrical/Electronic Engineering / Computer Science
- Familiar with 3D IC Design, like CoWoS, SoIC, EMIB etc.
- Familiar with IC Design front-to-backend flow
- Preferably well-versed in Calibre
- Proficient in script programming, such as Python, Tcl, Perl or C-shell
- Proficient in UNIX (Linux) platforms
- Strong communication skills, problem solving and analytical skills.
Location: One North, Singapore
