The Manufacturing Process Engineer is responsible for developing, optimizing, and sustaining manufacturing processes to ensure high product quality, productivity, and operational efficiency. The role focuses on supporting die pick-and-place and reflow curing processes while driving continuous improvement, process capability enhancement, yield improvement, and equipment performance.
What a Semicon Manufacturing Process Engineer Does At HP
- Develop, optimize, and sustain manufacturing processes to achieve quality, cost, delivery, and productivity objectives.
- Provide technical ownership and support for die pick-and-place and reflow curing processes.
- Monitor process performance using statistical analysis and identify opportunities for yield and quality improvement.
- Investigate process-related issues, perform root cause analysis, and implement effective corrective and preventive actions (CAPA).
- Lead continuous improvement initiatives to improve process capability, cycle time, equipment utilization, and manufacturing efficiency.
- Develop, validate, and maintain process documentation, including work instructions, process specifications, FMEA, control plans, and standard operating procedures (SOPs).
- Support new product introduction (NPI), process qualification, and engineering change implementation.
- Collaborate with Production, Quality, Equipment Engineering, Manufacturing Engineering, and suppliers to resolve technical issues and improve manufacturing performance.
- Working closely with Technical Specialist to support equipment evaluation, process characterization, and qualification activities.
- Ensure manufacturing processes comply with safety, quality, and customer requirements.
- Drive data-based decision-making by analysing process trends and implementing sustainable improvements.
Individuals who do well in this role at HP, usually possess:
- Bachelor’s degree in Manufacturing engineering, Mechanical Engineering, or a related engineering discipline.
- Equivalent work experience or demonstrated technical competence will also be considered.
- 2–3 years of experience in Process Engineering within the semiconductor or SMT (Surface Mount Technology) manufacturing industry.
- Hands-on experience supporting manufacturing processes in a high-volume production environment.
- Exposure to Lean Manufacturing or Six Sigma methodologies.
- Experience supporting new product introduction (NPI) and process qualification activities.
- Knowledge of quality management systems and manufacturing best practices.
- Experience with process optimization, troubleshooting, and continuous improvement projects.
Technical Skills
- Good understanding of die pick-and-place processes.
- Good knowledge of reflow curing processes and process optimization.
- Familiarity with process control methodologies, SPC, DOE, FMEA, and root cause analysis tools (e.g., 5 Why, Fishbone).
- Ability to interpret engineering drawings, process specifications, and manufacturing documentation.
- Experience using data analysis tools such as Microsoft Excel, Minitab, or similar statistical software is an advantage.
Soft Skills
- Strong analytical and problem-solving skills.
- Good communication and interpersonal skills.
- Ability to work effectively in cross-functional teams.
- Self-motivated with a continuous improvement mindset.
- Able to manage multiple priorities in a fast-paced manufacturing environment.
- Good planning, organization, and execution skills.
Sustainable impact is HP’s commitment to create positive, lasting change for the planet, its people, and our communities. This serves as a guiding principle for delivering on our corporate vision – to create technology that makes life better for everyone, everywhere.
